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50 Mega Pixel Camera

Ha. You could never shoot sports with MF. Do you have any idea how many AF points you'd need? Hundreds.

1 dead center.

Of course to get 10 frames a second I'm going to need 10 of those monsters on a rail.
 
As for the yields ... if they produced sensors and wafers for all sizes in one production line, and leave the large ones with no faults uncut, but from those with one fault or more make smaller and smaller sensors, more than one on one wafer, then this would mean a drastic cut in costs for the large ones. .. given that the demand ratio for different sensor sizes is similar to the ratio produced by this method.

I don't think this would work in practice because of the megapixel expectations of consumers. If you consider just for example a D3 sensor has a single fault even close to the edge, assuming you can simply cut a smaller section out it completely rules out the sensor for use in the D300, D200, and most definitely rules out the sensor for any P&S cameras which have much smaller photodiodes and would still need a high megapixel count.

Without any specific insider information I don't think anything is certain, but if you take an example of Sony's book, how they shipped many Playstation 3 units with only 7 of the 8 cores working on the Cell processor because of yield problems, I think we may still be a long way from sufficiently error free manufacturing to rule out yields as covering a large chunk of the cost of large sensors, compared to actual wafer real estate.

Does anyone here work with this kind of stuff?
 
I don't think this would work in practice because of the megapixel expectations of consumers. If you consider just for example a D3 sensor has a single fault even close to the edge, assuming you can simply cut a smaller section out it completely rules out the sensor for use in the D300, D200, and most definitely rules out the sensor for any P&S cameras which have much smaller photodiodes and would still need a high megapixel count.

that is true in a sense, but we are approaching limits regarding the density. not saying we are there yet, but the pixel density at some point makes hardly any sense anymore. if that state is reached, then cutting a wafer meant for a medium format sensor into 4 smaller ones, and if any of those is faulty, again in 4 smaller ones, that would make sense. Assuming a sort of maximum sensible density is reached. It only makes sense that a larger format sensor in the end has a higher pixel resolution.

Does anyone here work with this kind of stuff?

Never working in the semiconductor industry, but for the semiconductor industry ...
 
Top of the line.

I still love the old school Hasselblad 500. And at these prices thats all I'll be able to use. AAU has one (Not 50mp) but only masters students can use the digital hasselblad :(

I can only hope to get enough work to warrant spending 30 grand on a body.
 
The digital MF backs are made in different pixel sizes. The high pixel count cameras are considered important for large portrait work (think Times Square billboards) because they provide the highest level of gradation in skin tones - for instance. Sharpness is achieved with slightly bigger pixels, so the high-count pixel backs are not necessarily the best for landscape work... but at this level of photography there is no "better" - you really need to pick the tool for the kind of photography you want to do.
 
But, They have been printing Times Square billboards for years without 50gb plus cameras
 

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